Title:
チャンバコンポーネントを接合するために使用される接着材料
Document Type and Number:
Japanese Patent JP2014503611
Kind Code:
A
Abstract:
Embodiments of the invention provide a robust bonding material suitable for joining semiconductor processing chamber components. Other embodiments provide semiconductor processing chamber components joined using an adhesive material with desired characteristics. In one embodiment, an adhesive material suitable for joining semiconductor chamber components includes an adhesive material having a Young's-modulus lower than 300 psi. In another embodiment, a semiconductor chamber component includes a first surface disposed adjacent a second surface, and an adhesive material coupling the first and second surfaces, wherein the adhesive material has a Young's modulus lower than 300 psi.
Inventors:
San Jennifer Wye
Banda Smans
Banda Smans
Application Number:
JP2013538813A
Publication Date:
February 13, 2014
Filing Date:
November 07, 2011
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
C09J201/00; C09J7/00; C09J183/04; H01L21/3065; C23C16/455
Domestic Patent References:
| JP2007194616A | 2007-08-02 | |||
| JP2008103681A | 2008-05-01 | |||
| JP2008042197A | 2008-02-21 | |||
| JP2012511834A | 2012-05-24 | |||
| JP2006013302A | 2006-01-12 | |||
| JP2007194320A | 2007-08-02 | |||
| JP2007191537A | 2007-08-02 | |||
| JP2000017246A | 2000-01-18 | |||
| JP2008308618A | 2008-12-25 |
Foreign References:
| WO2010068635A2 | 2010-06-17 | |||
| US20070131912A1 | 2007-06-14 |
Attorney, Agent or Firm:
Yoshiaki Anzai