Title:
金属を不動態化する化学機械研磨用組成物及び方法
Document Type and Number:
Japanese Patent JP2014507799
Kind Code:
A
Abstract:
The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing copper- and/or silver-containing substrates. The compositions of the present invention comprise a particulate abrasive, a primary film-forming metal-complexing agent, and a secondary film-forming metal-passivating agent in an aqueous carrier. Methods of polishing a substrate with the compositions of the invention are also disclosed.
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Inventors:
Jason Kelleher
Pankaji Shin
Blaster bullsick
Pankaji Shin
Blaster bullsick
Application Number:
JP2013549488A
Publication Date:
March 27, 2014
Filing Date:
January 10, 2012
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORPORATION
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| JP2011505694A | 2011-02-24 | |||
| JP2004521484A | 2004-07-15 | |||
| JP2009505397A | 2009-02-05 | |||
| JP2009117789A | 2009-05-28 | |||
| JP2005167231A | 2005-06-23 | |||
| JP2012069785A | 2012-04-05 | |||
| JP2011505694A | 2011-02-24 |
Foreign References:
| US20090090888A1 | 2009-04-09 | |||
| US20060063687A1 | 2006-03-23 | |||
| US20090134122A1 | 2009-05-28 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Masatoshi Takahashi
Satoshi Deno
Naori Kota
Naohisa Akashi
Takashi Ishida
Tetsuji Koga
Masatoshi Takahashi
Satoshi Deno
Naori Kota
Naohisa Akashi