Title:
導電性粒子およびその製造方法
Document Type and Number:
Japanese Patent JP2014510192
Kind Code:
A
Abstract:
Disclosed herein is a conductive particle, including: a base particle containing a metal; a seed particle formed on a surface of the base particle; and a first metal layer formed on the base particle, wherein the first metal layer includes a protrusion surrounding the seed particle. The conductive particle has excellent specific resistance characteristics when it is sintered because it has nanosized protrusions formed on the surface of a metal base particle.
Inventors:
Won-Il Sung
You Jin Sim
Suk-Hong Oh
You Jin Sim
Suk-Hong Oh
Application Number:
JP2013551927A
Publication Date:
April 24, 2014
Filing Date:
November 23, 2012
Export Citation:
Assignee:
Hanwa Chemical Corporation
International Classes:
B22F1/02; B22F1/00; H01B1/00; H01B1/22; H01B5/00; H01B5/14; H01B13/00; H01L31/04; H05K3/32; H05K3/36
Domestic Patent References:
| JP2007242307A | 2007-09-20 |
Foreign References:
| WO2007058159A1 | 2007-05-24 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro