Title:
硬化性組成物
Document Type and Number:
Japanese Patent JP2014520946
Kind Code:
A
Abstract:
A curable composition and use thereof are provided. The composition can be useful in exhibiting excellent processability and workability, and providing a cured product which exhibits superior light extraction efficiency, crack resistance, hardness, thermal shock resistance, and adhesive properties, has superior reliability under severe conditions for a long period of time and prevents opacity and stickiness onto a surface thereof when cured. Also, the curable composition capable of preventing precipitation of an additive such as a fluorescent material or a photoconversion material and being formed into a cured product having excellent transparency even when the additive is added to the curable composition can be provided.
Inventors:
The Min Jin コ
ミュン Sun ムン
ジェ ホ Jun
ブム ギュ Choi
デ ホ can
Min Kuen Kim
ビュン キュ チョ
ミュン Sun ムン
ジェ ホ Jun
ブム ギュ Choi
デ ホ can
Min Kuen Kim
ビュン キュ チョ
Application Number:
JP2014521572A
Publication Date:
August 25, 2014
Filing Date:
July 23, 2012
Export Citation:
Assignee:
Elgey Kem Limited
International Classes:
C08L83/05; C08K3/22; C08K3/36; C08L83/07
Domestic Patent References:
| JP2008231199A | 2008-10-02 | |||
| JP2012041496A | 2012-03-01 | |||
| JP2011256251A | 2011-12-22 |
Foreign References:
| US20110140289A1 | 2011-06-16 | |||
| WO2011102272A1 | 2011-08-25 |
Attorney, Agent or Firm:
Shinya Jitsuhiro
Takashi Watabe
Takashi Watabe