Title:
耐溶媒性の可撓性基板用芳香族ポリアミドフィルム
Document Type and Number:
Japanese Patent JP2014522894
Kind Code:
A
Abstract:
Films with optical transmittance of >80% between 400 and 750 nm and with coefficient of thermal expansion less than 20 ppm/° C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have glass transition temperatures>300° C. The films are cross-linked in the solid state by heating at elevated temperatures for short periods of time in the presence of multifunctional epoxides. Surprisingly, the optical and thermal properties of the films do not change significantly during the curing process. The temperature required for the crosslinking process to take place can be reduced by the presence of a few free, pendant carboxyl groups along the polyamide backbones. The films are useful as flexible substrates for electronic displays and photovoltaic devices.
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Inventors:
Sun, リミン
Chang, a boss
Frank, Harris W.
Gin, ジアオカイ
Chang, a boss
Frank, Harris W.
Gin, ジアオカイ
Application Number:
JP2014519154A
Publication Date:
September 08, 2014
Filing Date:
June 29, 2012
Export Citation:
Assignee:
Akron Polymer Systems, in condominium lei テッド
International Classes:
C08G69/48; C08J5/18; C08L77/06
Domestic Patent References:
| JP2006111866A | 2006-04-27 | |||
| JP2010100695A | 2010-05-06 | |||
| JPH01279921A | 1989-11-10 | |||
| JPH01113435A | 1989-05-02 | |||
| JP2010059392A | 2010-03-18 | |||
| JP2005344005A | 2005-12-15 | |||
| JP2010502794A | 2010-01-28 | |||
| JP2009079210A | 2009-04-16 | |||
| JPH06913A | 1994-01-11 |
Foreign References:
| US5026819A | 1991-06-25 | |||
| US20070293626A1 | 2007-12-20 | |||
| US20080124534A1 | 2008-05-29 | |||
| US20090318660A1 | 2009-12-24 |
Attorney, Agent or Firm:
Ryoichi Takaoka
Oda Direct
Takahashi Kaori origin
Oda Direct
Takahashi Kaori origin