Title:
フレキシブルなビスマレイミド、ベンズオキサジン、エポキシ−無水物付加生成物複合接着剤
Document Type and Number:
Japanese Patent JP2014523953
Kind Code:
A
Abstract:
A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Preferably, a flexible epoxy anhydride adduct modified solid bismaleimide and solid benzoxazine resin composition that can survive high temperature and high moisture conditions and maintain good adhesion strength and minimize the stress resulting from a coefficient of thermal expansion mismatch between a silicon die and a substrate which is Ball Grid Array solder mask or a smart card polyethylene terephthalate or silver or copper metal lead frame.
Inventors:
Singh Yoon Gil
Application Number:
JP2014522722A
Publication Date:
September 18, 2014
Filing Date:
July 28, 2011
Export Citation:
Assignee:
Pro タヴィック Korea Company Limited PROTAVIC KOREA CO., LTD.
International Classes:
C09J179/00; C09J4/02; C09J11/04; C09J11/06; C09J109/00; C09J161/10; C09J163/00; C09J163/02; C09J163/04; C09J163/10
Domestic Patent References:
| JP2005532678A | 2005-10-27 |
Foreign References:
| WO2007083810A1 | 2007-07-26 |
Attorney, Agent or Firm:
Eye Py Dee international patent business corporation