Title:
ELECTRONIC APPARATUS, MANUFACTURING METHOD OF ELECTRONIC APPARATUS AND METAL MOULD
Document Type and Number:
Japanese Patent JP2018139274
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic apparatus in which the area of a board placed in an enclosure can be increased compared with prior art.SOLUTION: An electronic apparatus 1 includes a base 11 having a flat plate part 111, and sidewalls 112a, 112b provided upright at a part of the felly of the flat plate part 111, a printed circuit board 21A placed in the base 11 and having an element, and a cover 12 covering the base 11. The base 11 is placed in a space closer to the cover 12 side than a hole 113 provided in the flat plate part 111 in contact with the sidewalls 112a, 112b, and has a support part 118 having one end supported by the sidewall 112b, and a positioning member for positioning the cover 12, provided on the support part 118, for the base 11.SELECTED DRAWING: Figure 3
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Inventors:
YOSHIDA KAZUHIRO
Application Number:
JP2017033941A
Publication Date:
September 06, 2018
Filing Date:
February 24, 2017
Export Citation:
Assignee:
TOSHIBA MEMORY CORP
International Classes:
H05K5/00; B22D17/00; H05K7/14
Attorney, Agent or Firm:
Sakai International Patent Office