Title:
CIRCUIT BOARD CASE FIXING BUFFER MATERIAL, CIRCUIT BOARD FIXED WITH CASE, GYRO SENSOR FIXED WITH CASE, CIRCUIT BOARD FIXING STRUCTURE, AND CIRCUIT BOARD FIXING METHOD
Document Type and Number:
Japanese Patent JP2018146317
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a circuit board case fixing buffer material capable of simply fixing a circuit board and also capable of simply taking protective countermeasures against impact shocks and vibrations.SOLUTION: A circuit board case fixing buffer material 5 is a buffer material used when fixing a circuit board 1 to a case of two member engagement type, and includes a side end part storage groove 6 for storing side end parts of the circuit board 1 including each of upper and lower corner parts. The quality of the circuit board case fixing butter material 5 may be any if having buffering capacity and elasticity including urethane and synthetic rubber.SELECTED DRAWING: Figure 2
Inventors:
MATSUI TOMOHIRO
Application Number:
JP2017040023A
Publication Date:
September 20, 2018
Filing Date:
March 03, 2017
Export Citation:
Assignee:
TAMAGAWA SEIKI CO LTD
International Classes:
G01C19/5783; H05K7/14
Attorney, Agent or Firm:
Tomonari Tomizawa