Title:
SENSOR ATTACHMENT STATE DETERMINATION SYSTEM, SENSOR ATTACHMENT STATE DETERMINATION DEVICE, AND METHOD FOR DETERMINING SENSOR ATTACHMENT STATE
Document Type and Number:
Japanese Patent JP2018155661
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sensor attachment state determination system, a sensor attachment state determination device, and a method for determining a sensor attachment state which can determine the attachment state of a sensor attached to a structure.SOLUTION: The sensor attachment state determination system includes: a plurality of sensors; a calculation unit; and a determination unit. The sensors detect elastic waves. The calculation unit calculates the peak frequency of the elastic waves on the basis of the elastic waves detected by the sensors. The determination unit determines the attachment state of the sensors by comparing the peak frequency with information serving as the basis for determination.SELECTED DRAWING: Figure 1
Inventors:
TAKAMINE HIDEFUMI
WATABE KAZUO
WATABE KAZUO
Application Number:
JP2017053719A
Publication Date:
October 04, 2018
Filing Date:
March 17, 2017
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
G01N29/14; G01N29/46
Domestic Patent References:
| JPS62235559A | 1987-10-15 | |||
| JPS62235560A | 1987-10-15 | |||
| JP2000002691A | 2000-01-07 | |||
| JP2002350409A | 2002-12-04 | |||
| JP2016061701A | 2016-04-25 |
Foreign References:
| WO2017018112A1 | 2017-02-02 | |||
| US20160084803A1 | 2016-03-24 |
Attorney, Agent or Firm:
Shiga International Patent Office