Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2018184595
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition that makes it possible to obtain a cured product having a high fine-circuit forming ability and a low dielectric loss tangent, even when using an inorganic filler with a small average particle size or a large specific surface, wherein the resin composition has a low minimum melt viscosity and good laminate properties.SOLUTION: A resin composition contains (A) an epoxy resin, (B) an active ester curing agent, (C) a polyimide resin, and (D) an inorganic filler with an average particle size of 100 nm or less. The content of (C) component is 0.1 mass% or more and 6 mass% or less relative to the resin component 100 mass%.SELECTED DRAWING: None
Inventors:
FUJISHIMA SHOHEI
Application Number:
JP2018075657A
Publication Date:
November 22, 2018
Filing Date:
April 10, 2018
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
C08L63/00; B32B15/08; B32B15/088; B32B15/092; C08G59/42; C08K3/013; C08L79/08; H05K1/03; H05K3/46
Domestic Patent References:
| JP2014062150A | 2014-04-10 | |||
| JP2007224242A | 2007-09-06 | |||
| JP2013077590A | 2013-04-25 | |||
| JP2005325332A | 2005-11-24 | |||
| JP2016194055A | 2016-11-17 | |||
| JP2013199645A | 2013-10-03 |
Attorney, Agent or Firm:
Sakai International Patent Office