Title:
POLISHING DEVICE AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2018187724
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing device which can reduce power usage of the entire device, and to provide a substrate processing device.SOLUTION: A polishing module 21 has: a polishing table 23 having a polishing pad 22 to which a substrate W is pressed; a motor 23a which rotates the polishing table 23; and a polishing pad temperature adjustment device 50 which supplies a liquid to the polishing pad 22 and adjusts a surface temperature of the polishing pad 22. The polishing pad temperature adjustment device 50 has: a liquid supply tank 53 which stores a liquid; and a heater 56 which heats the liquid. The polishing module 21 includes: a heat recovery device 60 which supplies a refrigerant to the motor 23a and recovers heat of the motor 23a; and a liquid supply device 70 which supplies the refrigerant, which recovers the heat of the motor 23a, to the liquid supply tank 53 as a liquid for adjusting the surface temperature of the polishing pad 22.SELECTED DRAWING: Figure 2
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Inventors:
ISOKAWA HIDETATSU
Application Number:
JP2017092769A
Publication Date:
November 29, 2018
Filing Date:
May 09, 2017
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B37/015; B24B37/10; B24B55/02; H01L21/304
Attorney, Agent or Firm:
Sumio Tanai
Yasushi Matsunuma
Yuichiro Shimizu
Hisanori Takahashi
Yasushi Matsunuma
Yuichiro Shimizu
Hisanori Takahashi