Title:
ADHESIVE BONDING APPARATUS
Document Type and Number:
Japanese Patent JP2018188248
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive bonding apparatus capable of suppressing adhesion failure caused by a change in ejection distance while suppressing a reduction in work efficiency when adhesive-bonding a sheet having a step portion.SOLUTION: The adhesive bonding apparatus ejects an adhesive Z from an ejection port 11D of a nozzle to a lower cloth C1 disposed on a lower cloth support surface 420A of a lower cloth support section 420. A second roller 57 is disposed above a first roller 56 with the lower cloth C1 in between and can move up and down. The second roller 57 moves up and down at the time that step portions K1 and K2 of the lower cloth C1 pass between the first roller 56 and the second roller 57. A magnetic sensor detects a vertical position of the second roller 57. A CPU of the adhesive bonding apparatus moves up and down the lower cloth support section 420 on the basis of the vertical position of the second roller 57 detected by the magnetic sensor.SELECTED DRAWING: Figure 18
Inventors:
MURAKAMI KENJI
SHIBATA ITARU
TADA SATORU
SHIBATA ITARU
TADA SATORU
Application Number:
JP2017090634A
Publication Date:
November 29, 2018
Filing Date:
April 28, 2017
Export Citation:
Assignee:
BROTHER IND LTD
International Classes:
B65H37/04
Domestic Patent References:
| JP2012136323A | 2012-07-19 | |||
| JPH11348373A | 1999-12-21 | |||
| JPH04100865U | 1992-09-01 | |||
| JPH07256976A | 1995-10-09 | |||
| JPH03193375A | 1991-08-23 |
Attorney, Agent or Firm:
Hisashi Yamamoto