Title:
AQUEOUS ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2018199793
Kind Code:
A
Abstract:
To provide an aqueous adhesive composition containing no formaldehyde which can contribute to improved mechanical properties, e.g. the strength or elastic modulus of a mold material, compared with a phenol resin composition containing formaldehyde, and further provide a mold material obtained by using the aqueous adhesive composition.SOLUTION: The present invention provides an aqueous adhesive composition containing (A) a modified sugar which is a material produced from (a) a saccharide and (b) a radical initiator. Preferably, the aqueous adhesive composition further contains (c) an amine-derived structure. The aqueous adhesive composition further contains (B) an inorganic acid salt.SELECTED DRAWING: None
Inventors:
TABOJIN GO
YOSHIDA YOSHIO
HAYAKAWA TADASHI
YOSHIDA YOSHIO
HAYAKAWA TADASHI
Application Number:
JP2017105732A
Publication Date:
December 20, 2018
Filing Date:
May 29, 2017
Export Citation:
Assignee:
HENKEL JAPAN LTD
International Classes:
C09J105/00; C09J11/04
Domestic Patent References:
| JPH05163471A | 1993-06-29 | |||
| JPH0827695A | 1996-01-30 | |||
| JP2013532208A | 2013-08-15 | |||
| JPH01162894A | 1989-06-27 | |||
| JPH1077301A | 1998-03-24 | |||
| JP2002523108A | 2002-07-30 | |||
| JP2017031360A | 2017-02-09 | |||
| JP2009503193A | 2009-01-29 | |||
| JPS5681378A | 1981-07-03 |
Foreign References:
| KR101595275B1 | 2016-02-18 | |||
| US20080020948A1 | 2008-01-24 | |||
| WO2017072186A1 | 2017-05-04 |
Attorney, Agent or Firm:
Samejima Mutsumi
Kenichi Morizumi
Fukumasa Mitsuru
Kenichi Morizumi
Fukumasa Mitsuru