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Title:
SYSTEM FOR FORMING THIN FILM SEALING STRUCTURE
Document Type and Number:
Japanese Patent JP2019003929
Kind Code:
A
Abstract:
To provide a system for forming a thin film sealing structure, which is superior in mass productivity.SOLUTION: A system for forming a thin film sealing structure comprises: a film deposition apparatus 200 arranged to be capable of forming an organic thin film, and having a chamber 210, a stage 212 arranged so that the temperature of a face to accept a device substrate can be changed, a raw material-supplying unit capable of supplying a gas of a light-curable resin into the chamber, and a UV irradiation unit 230; an ashing apparatus disposed in a latter stage of the film deposition apparatus, and arranged so as to be able to perform plasma ashing on an organic thin film by use of at least one kind of gas of NO, Oand O; and a CVD apparatus arranged to be capable of forming an inorganic thin film and disposed in a latter stage of the ashing apparatus.SELECTED DRAWING: Figure 11

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Inventors:
NARUTAKI YOZO
KISHIMOTO KATSUHIKO
Application Number:
JP2018061868A
Publication Date:
January 10, 2019
Filing Date:
March 28, 2018
Export Citation:
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Assignee:
SAKAI DISPLAY PRODUCTS CORP
International Classes:
H05B33/10; H01L51/50; H05B33/04
Domestic Patent References:
JP2015220001A2015-12-07
JP2015176717A2015-10-05
JP2004047410A2004-02-12
JP2002057162A2002-02-22
JP2011049549A2011-03-10
JP2005327708A2005-11-24
JP2006222070A2006-08-24
JP2018180469A2018-11-15
JP2013020893A2013-01-31
JP2007250370A2007-09-27
JP2016039120A2016-03-22
JP2015173078A2015-10-01
JP2017068927A2017-04-06
Foreign References:
WO2014196137A12014-12-11
WO2015178059A12015-11-26
KR20160056487A2016-05-20
Attorney, Agent or Firm:
Seiji Okuda
Osamu Kita
Ryoji Yamashita
Akiko Miyake
Murase Nariyasu
Rinko Kita



 
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