Title:
GRINDING DEVICE
Document Type and Number:
Japanese Patent JP2019005841
Kind Code:
A
Abstract:
To grind a wafer and the like formed of a hard-to-grind material smoothly and with restrained abrasion of a grinding grindstone.SOLUTION: A grinding device 1 comprises a holding table 30 for holding a workpiece W, and grinding means 7 having a grinding wheel 74 for grinding the workpiece W held by the holding table 30. The grinding wheel 74 has a grinding grindstone 74a made of abrasive grains and photocatalyst grains joined by vitrified, and comprises grinding water supply means 8 for supplying grinding water to at least the grinding grindstone 74a during grinding of the workpiece W held by the holding table 30 with the grinding means 7, and light emitting means 9 arranged adjacent to the holding table 30 and emitting light to a grinding surface of the grinding grindstone 74 on which the workpiece W held by the holding table 30 is to ground.SELECTED DRAWING: Figure 1
Inventors:
TAKENOUCHI KENJI
Application Number:
JP2017123036A
Publication Date:
January 17, 2019
Filing Date:
June 23, 2017
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B7/04; B24B1/00; B24B55/02; B24D3/14; B24D3/34; H01L21/304
Domestic Patent References:
| JP2016162915A | 2016-09-05 | |||
| JPS6219377A | 1987-01-28 | |||
| JP2014192271A | 2014-10-06 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office