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Patent Searching and Data


Title:
SUBSTRATE POLISHING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP2019013999
Kind Code:
A
Abstract:
To adjust a travel speed of a dresser which performs dressing of a polishing member.SOLUTION: This substrate polishing device comprises: a dresser which is oscillated on a polishing member thereby dressing the polishing member, and of which an oscillation speed can be adjusted in plural scanning areas which are set onto the polishing member along an oscillation direction; a height detection part which measures a surface height of the polishing member in plural monitoring areas which have been previously set onto the polishing member along the oscillation direction of the dresser; a dress model matrix preparation part which prepares a dress model matrix which is defined from plural monitoring areas, scanning areas and a dress model; an evaluation index preparation part which calculates a height profile prediction value by use of an oscillation speed and a residence time in the dress model and each scanning area, and sets an evaluation index on the basis of a difference form a target value of a height profile of the polishing member; and a movement speed calculation part which calculates a movement speed of the dresser in each scanning area on the basis of the evaluation index.SELECTED DRAWING: Figure 8

Inventors:
HIROO YASUMASA
YAGI KEITA
Application Number:
JP2017131968A
Publication Date:
January 31, 2019
Filing Date:
July 05, 2017
Export Citation:
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Assignee:
EBARA CORP
International Classes:
B24B53/017; B24B37/34; B24B49/18; H01L21/304
Domestic Patent References:
JP2014161944A2014-09-08
JP2010076049A2010-04-08
JP2009148877A2009-07-09
JP2013525126A2013-06-20
JP2014161938A2014-09-08
JP2013163262A2013-08-22
JP2012254490A2012-12-27
Foreign References:
US20080009231A12008-01-10
Attorney, Agent or Firm:
Seiji Ohno
Kobayashi Hideyoshi
Hiroyuki Ohno
Koji Morita
Osamu Tsuda
Matsuno Chihiro
Seiichi Sakitani
Hiroshi Nomoto