Title:
METHOD OF FORMING ELECTROCONDUCTIVE THIN WIRE
Document Type and Number:
Japanese Patent JP2019023321
Kind Code:
A
Abstract:
To provide a method of forming an electroconductive thin wire, capable of reducing both width and electrical resistance of an electroconductive thin wire, and of improving the reliability of its electrical functions.SOLUTION: The method of forming an electroconductive thin wire 6 is characterized by comprising a step of laying a liquid comprising an electroconductive material on a substrate 1 in a form of a line to form a line-shaped liquid, a step of subsequently drying the line-shaped liquid to form a line segment 3 comprising an electroconductive material, a step of subsequently forming a metal layer 5 in a manner of covering the line segment 3, and a step of subsequently removing at least a part of the metal layer 5 or a part of the metal layer 5 and the line segment 3 so as to decrease one side or both sides of the line width of the line segment 3 covered with the metal layer 5, to form the electroconductive thin wire 6.SELECTED DRAWING: Figure 2
Inventors:
OYA HIDENOBU
SUZUKI KEIICHIRO
YAMAUCHI MASAYOSHI
OMATA TAKENORI
NIIZUMA NAOTO
SUZUKI KEIICHIRO
YAMAUCHI MASAYOSHI
OMATA TAKENORI
NIIZUMA NAOTO
Application Number:
JP2015246519A
Publication Date:
February 14, 2019
Filing Date:
December 17, 2015
Export Citation:
Assignee:
KONICA MINOLTA INC
International Classes:
C25D5/56; C23F1/02; C25D5/12; H05K3/10; H05K3/22; H05K3/24
Attorney, Agent or Firm:
Eiichi Maruyama