Title:
WIRING/PIPING MATERIAL HOLDER AND ARRANGEMENT STRUCTURE FOR WIRING/AND PIPING MATERIAL
Document Type and Number:
Japanese Patent JP2019049299
Kind Code:
A
Abstract:
To provide a wiring/piping material holder capable of easily and speedily correcting slackening of a wiring/piping material.SOLUTION: A wiring/piping material holder 100 comprises a fixing part 103 for fixation to a structure, and holding parts 110, 120 holding a wiring/piping material P. The holding parts 110, 120 comprise arrangement spaces 111, 121, openings 112, 122, elastically deformable holding pieces 113, 123 holding the wiring/piping material P in the arrangement spaces 111, 121, and engagement pieces 114, 124 engaging the wiring/piping material P to restrict the wiring/piping material P from moving in a longer direction. The holding pieces 113, 123 are configured to hold the wiring/piping material P while maintaining the engagement between the engagement pieces 114, 124 and wiring/piping material P. The holding pieces 113, 123 are elastically deformable to allow the wiring/piping material P to move in the arrangement spaces 111, 121 until the wiring/piping material separates from the engagement pieces 114, 124.SELECTED DRAWING: Figure 1
Inventors:
TAKAHASHI JUNJI
Application Number:
JP2017173287A
Publication Date:
March 28, 2019
Filing Date:
September 08, 2017
Export Citation:
Assignee:
MIRAI IND
International Classes:
F16L3/12; F16B2/10
Attorney, Agent or Firm:
Hiroe Associates Patent Office