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Title:
MANUFACTURING METHOD OF LIGHT-EMITTING ELEMENT MOUNTING PACKAGE
Document Type and Number:
Japanese Patent JP2019050245
Kind Code:
A
Abstract:
To provide a manufacturing method of a light-emitting element mounting substrate including an inner surface of a reflection plane of which the elevation angle is relatively small and which is wide and smooth.SOLUTION: The present invention relates to a manufacturing method of a light-emitting element mounting substrate 1a including a hole opening step for forming a through-hole 7h in a truncated conical shape in which a diameter of an opening closer to a front face 31 is large and a diameter of an opening closer to a rear face 32 is small, by inserting a distal end 21 including a cutting edge 24 of a drill 20 of which the axial direction is brought into a right-angle attitude with respect to the front face 31, while rotating it between the front face 31 and the rear face 32 with respect to a green sheet g3 which becomes a preceding-side ceramic layer tc later and comprises the front face 31 and the rear face 32 that face each other.SELECTED DRAWING: Figure 1

Inventors:
FUKUNAGA KAZUNORI
MIZOGUCHI KEN
Application Number:
JP2017172568A
Publication Date:
March 28, 2019
Filing Date:
September 08, 2017
Export Citation:
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Assignee:
NGK SPARK PLUG CO
International Classes:
H01L33/60
Domestic Patent References:
JP2007324150A2007-12-13
JP2000323438A2000-11-24
JP2006287126A2006-10-19
JP2006190983A2006-07-20
JP2004327503A2004-11-18
JP2015106568A2015-06-08
JP2005033114A2005-02-03
JPH0558706A1993-03-09
JP2002232017A2002-08-16
Foreign References:
US20120305970A12012-12-06
Attorney, Agent or Firm:
Suzuki Manabu