Title:
FIBER REINFORCED POLYAMIDE RESIN SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND MOLDED ARTICLE AND COMPOSITE MOLDED ARTICLE CONTAINING THE SAME
Document Type and Number:
Japanese Patent JP2019059852
Kind Code:
A
Abstract:
To provide a fiber reinforced polyamide resin substrate excellent in impregnation property and heat stability, less in void and excellent in surface quality.SOLUTION: There is provided a fiber reinforced polyamide resin substrate by impregnating a polyamide resin into a continuous reinforced fiber or a reinforced fiber substrate in which discontinuous reinforced fiber is dispersed, in which the polyamide resin is a terminal modified polyamide resin in which at least a part of a polymer constituting the polyamide resin has a structure constituted by a structural unit different from a repeated structural unit constituting a main chain of the polymer at a terminal group of the polymer, the terminal modified polyamide resin contains a terminal structure represented by the following general formula (I) of 1 to 20 mass%. -X-(R-O)-H (I). In the general formula (I), m represents a range of 2 to 100, Rrepresents a bivalent hydrocarbon group having 2 to 10 carbon atoms, -X- represents -NH-, -N(CH)- or -(C=O)-. m Rcontained in the general formula (I) may be same or different.SELECTED DRAWING: None
Inventors:
KOSHI MASAYUKI
NARUSE YOSHIHIRO
SUDO TAKESHI
UTAZAKI KENICHI
NARUSE YOSHIHIRO
SUDO TAKESHI
UTAZAKI KENICHI
Application Number:
JP2017185847A
Publication Date:
April 18, 2019
Filing Date:
September 27, 2017
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08J5/04; C08G69/48; C08G81/00