Title:
WIRING BOARD, LIGHT-EMITTING MODULE, AND METHOD FOR MANUFACTURING THE WIRING BOARD
Document Type and Number:
Japanese Patent JP2019062119
Kind Code:
A
Abstract:
To ensure the adhesion between a wiring layer and an insulation layer.SOLUTION: A wiring board herein disclosed comprises: a substrate main body having a metal substrate having a pair of opposing surfaces and an insulation layer formed on at least one of a pair of surfaces of the substrate; and a wiring layer formed on the insulation layer in the substrate main body. In the wiring board herein disclosed, a surface roughness of a surface of the substrate on a side where the insulation layer is formed is larger than a thickness of the insulation layer. In the wiring board, the insulation layer is thin to the surface roughness of the substrate as described above and as such, the surface roughness of the insulation layer is affected by the substrate to become larger and the adhesion between the insulation layer and the wiring layer is increased by an anchor effect.SELECTED DRAWING: Figure 1
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Inventors:
NISHIMURA MITSURU
MORITA MASAHITO
KITO NAOKI
MATSUNO TOSHIHIRO
MORITA MASAHITO
KITO NAOKI
MATSUNO TOSHIHIRO
Application Number:
JP2017186733A
Publication Date:
April 18, 2019
Filing Date:
September 27, 2017
Export Citation:
Assignee:
NGK SPARK PLUG CO
International Classes:
H05K1/05; H01L23/12; H01L23/28; H01L33/50; H01L33/62; H05K3/38
Attorney, Agent or Firm:
Nagoya International Patent Service Corporation