Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2019062121
Kind Code:
A
Abstract:
To provide a semiconductor device capable of preventing an encapsulation member from being peeled off from a base.SOLUTION: A semiconductor device comprises: a base 10; a semiconductor element 20 placed on the base; a porous metal sintered body 30 provided on the base in a region different from a region where the semiconductor element is placed; and an encapsulation member 40 arranged in the porous metal sintered body and that covers the semiconductor element.SELECTED DRAWING: Figure 2
Inventors:
KUNIMUNE TEPPEI
KURAMOTO MASAFUMI
KURAMOTO MASAFUMI
Application Number:
JP2017186760A
Publication Date:
April 18, 2019
Filing Date:
September 27, 2017
Export Citation:
Assignee:
NICHIA KAGAKU KOGYO KK
International Classes:
H01L23/28; H01L29/739; H01L29/78; H01L29/861; H01L29/868; H01L33/54; H01L33/56
Domestic Patent References:
| JP2016152386A | 2016-08-22 |