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Title:
SUBSTRATE-LESS DOUBLE-SIDED ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2019065218
Kind Code:
A
Abstract:
To provide a substrate-less double-sided adhesive sheet capable of suppressing spot transfer when a light peeling film is peeled.SOLUTION: A substrate-less double-sided adhesive sheet 10 which has a light-to-release film 11, an adhesive layer 1 provided on the light-to-release film and a heavy-to-release film 12 provided on the adhesive layer, where the light-to-release film 11 has a first biaxially oriented polyester film 2 and a first silicone resin layer 3 provided on a stuck surface of the first biaxially oriented polyester film and the adhesive layer, the heavy-to-release film 12 has a second biaxially oriented polyester film 4 and a second silicone resin layer 5 provided on a stuck surface of the second biaxially oriented polyester film and the adhesive layer, and a small melting heat quantity peal temperature of the first biaxially oriented polyester film 2 is lower than [Tmp-40]°C (Tmp: melting point of polyester).SELECTED DRAWING: Figure 1

Inventors:
KUROKAWA ATSUSHI
OHARA EMIKO
ENDO YUKI
Application Number:
JP2017193550A
Publication Date:
April 25, 2019
Filing Date:
October 03, 2017
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
C09J7/00; B32B27/00; B32B27/36; C09J201/00
Domestic Patent References:
JP2013203958A2013-10-07
JP2013136208A2013-07-11
JP2010228189A2010-10-14
JP2016141058A2016-08-08
JP2004115782A2004-04-15
Attorney, Agent or Firm:
Tamotsu Otani
Makoto Kataoka
Arinaga Shun
Yuichi Takehara