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Title:
REACTIVE HOT-MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2019065220
Kind Code:
A
Abstract:
To provide a reactive hot-melt adhesive composition which is excellent in thermal stability and has high adhesive strength even when applied to a member having low moisture permeability.SOLUTION: The reactive hot-melt adhesive composition contains: a urethane prepolymer which has a polymer chain containing a structural unit derived from a polyol and a structural unit derived from a polyisocyanate, and has an isocyanate group at a terminal of the polymer chain; and a morpholine-based curing catalyst. The polyol contains a polyether polyol having a group represented by formula (1).SELECTED DRAWING: None

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Inventors:
ARIMA NANAKO
KOMIYA SOICHIRO
ISHIDA SHOTA
MAGOME KAZUYUKI
Application Number:
JP2017193703A
Publication Date:
April 25, 2019
Filing Date:
October 03, 2017
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J175/04; C08G18/10; C08G18/20; C08G18/48; C09J11/06; C09J175/08
Domestic Patent References:
JP2005320520A2005-11-17
JP2018184510A2018-11-22
JP2007091996A2007-04-12
JP2007161991A2007-06-28
Foreign References:
WO2016002335A12016-01-07
WO2015056478A12015-04-23
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano



 
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