Title:
WIRING BOARD
Document Type and Number:
Japanese Patent JP2019079969
Kind Code:
A
Abstract:
To provide a wiring board that has a computing ability excellent in reliability.SOLUTION: A wiring board comprises: a laminate 1 that includes a plurality of insulating layers 4 and a plurality of metal layers 5 that are alternately laminated; component mounting areas W that are located on the back side of the laminate 1; a plurality of via holes 2 that are respectively located in the plurality of insulating layers 4; and via conductors 6 that are located in the via holes 2 and include solder particles. The via holes 2 are located in the plurality of insulating layers 4 such that projection parts on the back side in plan view overlap at least the entire component mounting areas W.SELECTED DRAWING: Figure 1
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Inventors:
MATSUZONO SEIGO
Application Number:
JP2017206735A
Publication Date:
May 23, 2019
Filing Date:
October 26, 2017
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H05K3/46