Title:
MULTILAYER FILM FOR CONDUCTIVE FILM, AND CONDUCTIVE FILM
Document Type and Number:
Japanese Patent JP2019098523
Kind Code:
A
Abstract:
To provide a multilayer film of which degree of curl is suppressed even under a heating condition, and a conductive film containing the multilayer film.SOLUTION: A multilayer film for conductive film contains a substrate layer and a protective layer, in which the substrate layer has a first surface and a second surface and is formed by a resin A, the protective layer is arranged in a side of a first surface of the substrate layer and formed by a resin B different from the resin A, absolute value of difference between linear expansion coefficient of the substrate layer αand linear expansion coefficient of the protective layer αis 0 ppm/°C to 20 ppm/°C, and absolute value of difference between thermal shrinkage of the substrate layer Sand thermal shrinkage of the protective layer Sin at least one direction is 0% to 0.15%.SELECTED DRAWING: Figure 1
Inventors:
YAMANAKA SHUNSUKE
Application Number:
JP2017227819A
Publication Date:
June 24, 2019
Filing Date:
November 28, 2017
Export Citation:
Assignee:
NIPPON ZEON CO
International Classes:
B32B7/027; B32B27/08; H01B5/14
Attorney, Agent or Firm:
Sakai International Patent Office