Title:
RESIN COMPOSITION USED FOR FLUX FOR SOLDER, AND FLUX FOR SOLDER
Document Type and Number:
Japanese Patent JP2019119795
Kind Code:
A
Abstract:
To provide a resin composition capable of suppressing cracks of a residue and a flux for solder.SOLUTION: A resin composition contains one of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or 2 more kinds of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine and rosin, and a ratio of rosin amount and amount of one of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine or total amount of 2 or more kinds of dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine is 0.35 to 1.00 based on rosin. A flux for solder is one by diluting the resin composition with a solvent.SELECTED DRAWING: None
Inventors:
SHIRATORI MASATO
KAWASAKI HIROYOSHI
YAMASAKI HIROYUKI
KAWASAKI HIROYOSHI
YAMASAKI HIROYUKI
Application Number:
JP2017255178A
Publication Date:
July 22, 2019
Filing Date:
December 29, 2017
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
International Classes:
C08L93/04; B23K35/363; C08K5/17
Attorney, Agent or Firm:
Yamaguchi International Patent Office