Title:
SPUTTERING TARGET
Document Type and Number:
Japanese Patent JP2019119920
Kind Code:
A
Abstract:
To provide a sputtering target comprising a sintered body containing Si and Zr, capable of suppressing generation of particles in sputtering, and capable of sputtering stably.SOLUTION: In a sputtering target comprising a sintered body containing Si and Zr, the content of Zr is in the range of 0.7 atom % or more and 50 atom % or less, and the total content of one or two or more kinds of additional elements selected from B, Fe, Mg is in the range of 100 mass ppm or more and 5,000 mass ppm or less.SELECTED DRAWING: None
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Inventors:
RIKUTA YUYA
Application Number:
JP2018002184A
Publication Date:
July 22, 2019
Filing Date:
January 10, 2018
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
C23C14/34; B22F5/00; C22C1/04; C22C16/00
Domestic Patent References:
| JPH0649632A | 1994-02-22 |
Foreign References:
| WO2012081340A1 | 2012-06-21 |
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami