APPARATUS FOR MANUFACTURING SEMICONDUCTOR AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Title:

APPARATUS FOR MANUFACTURING SEMICONDUCTOR AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2019147972

Kind Code:

A

Abstract:

To provide an apparatus for manufacturing a semiconductor, capable of forming a plating film excellent in the uniformity of film thickness on the surface to be plated of a semiconductor wafer using an electroless plating method.SOLUTION: The apparatus for manufacturing a semiconductor, capable of forming a plating film on a surface to be plated of each wafer held in a carrier capable of holding a plurality of wafers comprises: a rectification mechanism including a current plate having a plurality of through holes and held in the carrier to face the surface to be plated of each wafer; a dipping tank for storing a medical solution for forming the plating film to dip the carrier for holding the plurality of wafers and the rectification mechanism into the medical solution; and a drive for swing the carrier dipped into the dipping tank in the state of constantly maintaining a relative positional relationship between each wafer and the plurality of through holes.SELECTED DRAWING: Figure 1

Inventors:

UENO RYUJI
SUNAMOTO MASATOSHI

Application Number:

JP2018031785A

Publication Date:

September 05, 2019

Filing Date:

February 26, 2018

Export Citation:

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