Title:
POLISHING PAD, MANUFACTURING METHOD OF POLISHING PAD, METHOD FOR POLISHING SURFACE OF POLISHING OBJECT, AND METHOD FOR REDUCING SCRATCHES WHEN POLISHING SURFACE OF POLISHING OBJECT
Document Type and Number:
Japanese Patent JP2019155507
Kind Code:
A
Abstract:
To provide a polishing pad that is superior in dressing properties, and superior in scratch suppression while maintaining a polishing rate.SOLUTION: Provided is a polishing pad including an abrasive layer containing resin and first particles. In the polishing pad, an average particle diameter D50 of the first particles is 1.0 to less than 5.0 μm, a content of the first particles relative to the whole abrasive layer is 6.0-18.0 volume%, and a Mohs hardness of the first particles is less than a Mohs hardness of a polishing object.SELECTED DRAWING: None
Inventors:
TAKEDA MASANORI
SAEKI TAKU
KOSAKA YOSHIAKI
SAEKI TAKU
KOSAKA YOSHIAKI
Application Number:
JP2018043125A
Publication Date:
September 19, 2019
Filing Date:
March 09, 2018
Export Citation:
Assignee:
FUJIBO HOLDINGS INC
International Classes:
B24B37/24; H01L21/304
Domestic Patent References:
| JP2004507076A | 2004-03-04 | |||
| JP2013089767A | 2013-05-13 | |||
| JPH09171982A | 1997-06-30 | |||
| JP2003094321A | 2003-04-03 | |||
| JP2005246599A | 2005-09-15 | |||
| JP2000317842A | 2000-11-21 | |||
| JP2002231669A | 2002-08-16 | |||
| JP2002261054A | 2002-09-13 |
Attorney, Agent or Firm:
Shinjiro Ono
Osamu Yamamoto
Toru Miyamae
Motoharu Nakanishi
Toyoji Matsuda
Koichi Yokota
Osamu Yamamoto
Toru Miyamae
Motoharu Nakanishi
Toyoji Matsuda
Koichi Yokota