Title:
PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2019158949
Kind Code:
A
Abstract:
To provide a photosensitive resin composition achieving patterning property, a good pattern profile and reduced tackiness after prebaking.SOLUTION: The photosensitive resin composition of the present invention is a photosensitive resin composition for forming a film, which comprises a thermosetting resin, a curing agent and a photosensitive agent. The thermosetting resin comprises a solid epoxy resin that is solid at 25°C and a liquid epoxy resin that is liquid at 25°C. The curing agent comprises a phenolic curing agent. A ratio Y/X, where X (mass%) represents the content of the solid epoxy resin and Y (mass%) represents the content of the liquid epoxy resin with respect to the whole nonvolatile component of the photosensitive resin composition, is 0.01 or more and 0.60 or less.SELECTED DRAWING: Figure 1
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Inventors:
SUZUKI SAKIKO
TANAKA YUMA
TANAKA YUMA
Application Number:
JP2018041828A
Publication Date:
September 19, 2019
Filing Date:
March 08, 2018
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/038; C08G59/20; C08G59/62; G03F7/004; G03F7/075
Domestic Patent References:
| JP2014123096A | 2014-07-03 | |||
| JP2010230944A | 2010-10-14 |
Foreign References:
| WO2015190476A1 | 2015-12-17 | |||
| WO2015002071A1 | 2015-01-08 |
Attorney, Agent or Firm:
Shinji Hayami