Title:
FOCUS RING AND PLASMA PROCESSING APPARATUS INCLUDING THE SAME
Document Type and Number:
Japanese Patent JP2019169699
Kind Code:
A
Abstract:
To provide a focus ring capable of restraining increase in the size of a gap between an electrostatic chuck and the focus ring even by disturbance.SOLUTION: An annular focus ring 1 disposed on substrate placement tables 61, 65, 68, 71 for placing a processed substrate subjected to plasma processing includes an inner peripheral ring 2 disposed to surround the processed substrate placed on the substrate placement tables 61, 65, 68, 71, and an outer circumferential ring 3 disposed to surround the outer boundary of the inner peripheral ring 2. The inner peripheral ring 2 has annular shape combining multiple division rings divided in the hoop direction, the outer circumferential ring 3 is provided with a first inclined plane 3n having inner peripheral surface becoming higher from the outer peripheral side toward the inner peripheral side, and the outer circumferential ring 3 is configured so that the first inclined plane 3n abuts on at least a part of the outer peripheral surface of each division ring, and applies load to each division ring toward the center.SELECTED DRAWING: Figure 5
More Like This:
Inventors:
UCHIDA RYOHEI
Application Number:
JP2018226186A
Publication Date:
October 03, 2019
Filing Date:
December 03, 2018
Export Citation:
Assignee:
SPP TECH CO LTD
International Classes:
H01L21/3065
Domestic Patent References:
| JP2009290087A | 2009-12-10 | |||
| JP2011003730A | 2011-01-06 | |||
| JP2015159202A | 2015-09-03 | |||
| JP2015114313A | 2015-06-22 | |||
| JP2002110652A | 2002-04-12 | |||
| JP2013512573A | 2013-04-11 | |||
| JP2012109608A | 2012-06-07 | |||
| JP2011176228A | 2011-09-08 |
Foreign References:
| US20140224426A1 | 2014-08-14 |
Attorney, Agent or Firm:
Satoshi Murakami