Title:
MOLD COOLING DEVICE AND MOLD COOLING METHOD
Document Type and Number:
Japanese Patent JP2019181475
Kind Code:
A
Abstract:
To provide a mold cooling device and a mold cooling method smoothly fluidizing a coolant, and further, suppressing coolant leakage from a cooling flow passage, thus capable of improving quality defects caused by a change in cooling capacity.SOLUTION: A mold cooling device 101 comprises a first negative pressure generation part 15, a second negative pressure generation part 22 and a control part 23. The first negative pressure generation part is provided at the side of an outlet 4 in a cooling flow passage 2, generates negative pressure upon cooling of a mold and sucks a coolant in the cooling flow passage. The second negative pressure generation part is provided at the side of an inlet 3 in the cooling flow passage, and generates negative pressure. The control part controls the first negative pressure generation part and the second negative pressure generation part in such a manner that the value of the first pressure as the generation pressure by the first negative pressure generation part is made lower than the value of the second pressure as the generation pressure by the second negative pressure generation part.SELECTED DRAWING: Figure 1
Inventors:
YOKOTANI SUGURU
ARAI TAKESHI
KAMISAKA NAOTO
INOUE MAKOTO
MORI MASACHIKA
ARAI TAKESHI
KAMISAKA NAOTO
INOUE MAKOTO
MORI MASACHIKA
Application Number:
JP2018071018A
Publication Date:
October 24, 2019
Filing Date:
April 02, 2018
Export Citation:
Assignee:
DENSO CORP
International Classes:
B22D18/06; B22C9/06; B29C33/04
Domestic Patent References:
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Foreign References:
| WO2006098152A1 | 2006-09-21 |
Attorney, Agent or Firm:
Masaki Hattori