Title:
POWER MODULE MANUFACTURING DEVICE AND MANUFACTURING METHOD OF POWER MODULE
Document Type and Number:
Japanese Patent JP2019181715
Kind Code:
A
Abstract:
To provide a manufacturing device of a semiconductor power module, excellent in forming a uniform and high thickness-precision thin sealing resin layer on the lower side of terminal member and good filling of resin into such a thin sealing resin layer, and a manufacturing method with the device.SOLUTION: A power module manufacturing device M1 consists of a mold member 1, a first forming member 2, a second forming member 3, and a fixing member 4. The first forming member 2 is arranged inside the mold member 1. The second forming member 3 pours a second mold resin 102a into the mold member 1. The fixing member 4 fixes the first forming member 2 against the mold member 1. The first forming member 2 is arranged to be slidable with a terminal member 5 for mounting semiconductor elements in the mold member 1 across a first mold resin 101a arranged on the opposite of the semiconductor elements.SELECTED DRAWING: Figure 1
Inventors:
IWAI TAKAMASA
TERADA HAYATO
SAKAMOTO TAKESHI
HARADA HIROYUKI
SUDO SHINGO
TERADA HAYATO
SAKAMOTO TAKESHI
HARADA HIROYUKI
SUDO SHINGO
Application Number:
JP2018071640A
Publication Date:
October 24, 2019
Filing Date:
April 03, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B29C33/14; B29C45/02; B29C45/16; H01L21/56
Domestic Patent References:
| JP2017087551A | 2017-05-25 | |||
| JP2016152305A | 2016-08-22 | |||
| JPH10144827A | 1998-05-29 | |||
| JP2017094521A | 2017-06-01 |
Foreign References:
| WO2015159743A1 | 2015-10-22 | |||
| WO2006016609A1 | 2006-02-16 |
Attorney, Agent or Firm:
Fukami patent office