Title:
ADHESIVE SHEET WITH SUPPORT MEDIUM
Document Type and Number:
Japanese Patent JP2019196442
Kind Code:
A
Abstract:
To provide an adhesive sheet with a support medium capable of suppressing void generation, and excellent in component-embedding properties, and a circuit board using the adhesive sheet with a support medium.SOLUTION: The adhesive sheet with a support medium includes: a resin composition layer having a first surface, and a second surface; and a support medium bonded to the first surface, where the arithmetic average roughness (Ra2) of the second surface of the resin composition layer is 150 nm or more, and the tackiness strength at 80°C of the second surface of the resin composition layer is 1.1 N or more and 1.5 N or less.SELECTED DRAWING: Figure 1
Inventors:
KAWAI KENJI
Application Number:
JP2018090874A
Publication Date:
November 14, 2019
Filing Date:
May 09, 2018
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
C09J7/30; C09J163/00; C09J201/00; H05K1/03; H05K3/46
Domestic Patent References:
| JP2014012763A | 2014-01-23 | |||
| JP2014152306A | 2014-08-25 | |||
| JP2017119846A | 2017-07-06 | |||
| JP2015211086A | 2015-11-24 | |||
| JPWO2013111345A1 | 2015-05-11 | |||
| JP2014028880A | 2014-02-13 | |||
| JP2014036172A | 2014-02-24 | |||
| JP2010111859A | 2010-05-20 | |||
| JP2014136779A | 2014-07-28 |
Attorney, Agent or Firm:
Sakai International Patent Office