Title:
BUMP HEIGHT INSPECTION DEVICE, SUBSTRATE PROCESSING DEVICE, BUMP HEIGHT INSPECTION METHOD, AND STORAGE MEDIUM
Document Type and Number:
Japanese Patent JP2019197032
Kind Code:
A
Abstract:
To easily inspect a bump height.SOLUTION: A bump height inspection device includes: a lighting device for irradiating a substrate having a resist and a bump formed in an opening of the resist with light; an imaging device for imaging a pattern of the resist and the bump; and a controller for evaluating a height of the bump on the basis of a luminance value of image data of the pattern obtained by the imaging device.SELECTED DRAWING: Figure 2
Inventors:
OKUZONO TAKAHISA
TOMITA MASAKI
FUJIKATA JUNPEI
TOMITA MASAKI
FUJIKATA JUNPEI
Application Number:
JP2018092546A
Publication Date:
November 14, 2019
Filing Date:
May 11, 2018
Export Citation:
Assignee:
EBARA CORP
International Classes:
G01B11/02; C25D21/12; H01L21/304
Domestic Patent References:
| JP2015127653A | 2015-07-09 | |||
| JP2003160899A | 2003-06-06 | |||
| JP2005140584A | 2005-06-02 | |||
| JP2001153629A | 2001-06-08 | |||
| JPH11287623A | 1999-10-19 | |||
| JP2017218662A | 2017-12-14 |
Foreign References:
| US20030224596A1 | 2003-12-04 |
Attorney, Agent or Firm:
Shinjiro Ono
Toru Miyamae
Yukio Kanegae
Tatsumi Ono
Makoto Watanabe
Toru Miyamae
Yukio Kanegae
Tatsumi Ono
Makoto Watanabe