Title:
ULTRASONIC BONDING DEVICE AND ULTRASONIC BONDING METHOD
Document Type and Number:
Japanese Patent JP2019209369
Kind Code:
A
Abstract:
To provide an ultrasonic bonding device and an ultrasonic bonding method with which and by which flat members can be electrically bonded with each other without causing a defective short circuit even when a wiring pitch interval is narrow.SOLUTION: An ultrasonic bonding device includes: a stage where a first flat surface member and a second flat surface member to be bonded are set, and an ultrasonic horn having a pressing part pressed to lamination parts of the first flat surface member and the second flat surface member. The stage includes: a low-order side surface where the first flat surface member is set; a high-order side surface which is located at a higher position with respect to the low-order side surface by a prescribed step height and on which the second flat surface member is set; and a step wall surface located at a border between the low-order side surface and the high-order side surface.SELECTED DRAWING: Figure 1
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Inventors:
SUNAGA SEIJURO
MIYAKOSHI TOSHINOBU
MAKITA KOETSU
MIYAKOSHI TOSHINOBU
MAKITA KOETSU
Application Number:
JP2018109768A
Publication Date:
December 12, 2019
Filing Date:
June 07, 2018
Export Citation:
Assignee:
TDK CORP
International Classes:
B23K20/10; B06B3/00; H01L21/60; H01L21/607
Domestic Patent References:
| JPH05115986A | 1993-05-14 | |||
| JP2008296161A | 2008-12-11 | |||
| JP2014072270A | 2014-04-21 |
Foreign References:
| US20130112735A1 | 2013-05-09 |
Attorney, Agent or Firm:
Maeda/Suzuki International Patent Corporation