Title:
MANUFACTURING METHOD OF JOINT SUBSTRATE AND JOINT SUBSTRATE
Document Type and Number:
Japanese Patent JP2019217530
Kind Code:
A
Abstract:
To provide a manufacturing method of a joint substrate and the joint substrate which prevents occurrence of warping upon joint of a piezoelectric substrate and a support substrate and improves a joint strength.SOLUTION: A joint substrate 20 includes a piezoelectric substrate 17 formed from a single crystal substrate of piezoelectric material of either one of lithium tantalite, lithium niobate and quartz, a support substrate 18 formed from monocrystal or polycrystal substrate of semiconductor material of either one of silicone, germanium, silicon carbide, gallium-phosphorus and gallium arsenide and a joint layer 19 formed on a surface 17A of the piezoelectric substrate 17 with amorphous semiconductor material provided by making semiconductor material of the support substrate 18 amorphous. Therein, the piezoelectric substrate 17 and the support substrate 18 are joined at normal temperature via the joint layer 19.SELECTED DRAWING: Figure 3
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Inventors:
UCHIUMI ATSUSHI
SUZUKI TAKENORI
GOTO TAKAYUKI
IDE KENSUKE
TAKAGI HIDEKI
KURASHIMA YUICHI
SUZUKI TAKENORI
GOTO TAKAYUKI
IDE KENSUKE
TAKAGI HIDEKI
KURASHIMA YUICHI
Application Number:
JP2018116987A
Publication Date:
December 26, 2019
Filing Date:
June 20, 2018
Export Citation:
Assignee:
MITSUBISHI HEAVY IND MACHINE TOOL CO LTD
AIST
AIST
International Classes:
B23K20/00; H03H3/08; H03H9/25
Domestic Patent References:
| JP2017139720A | 2017-08-10 | |||
| JP3187231U | 2013-11-14 | |||
| JP2005252550A | 2005-09-15 |
Foreign References:
| WO2018088093A1 | 2018-05-17 |
Attorney, Agent or Firm:
Sakai International Patent Office