Title:
FLOOR PANEL ASSEMBLY AND METHOD OF MAKING FLOOR PANEL ASSEMBLY
Document Type and Number:
Japanese Patent JP2020006942
Kind Code:
A
Abstract:
To provide an improved floor panel assembly.SOLUTION: A heated floor panel for aircraft includes structural layers made of a fiber matrix and a high temperature thermoplastic resin. The structural layers are within the heated floor panel assembly to protect the other assembly components from damage and absorb stress. The heated floor panel assembly further includes a heating layer with a heating element, an impact layer, and a core layer to take shear stress exerted on the assembly.SELECTED DRAWING: Figure 1
Inventors:
HU JIN
NATHANIEL CHING
ZHAO WENPING
CASEY SLANE
GALDEMIR CEZAR BOTURA
NATHANIEL CHING
ZHAO WENPING
CASEY SLANE
GALDEMIR CEZAR BOTURA
Application Number:
JP2019114175A
Publication Date:
January 16, 2020
Filing Date:
June 20, 2019
Export Citation:
Assignee:
GOODRICH CORP
International Classes:
B64C1/18; B32B3/12; B32B5/02; B32B5/18; B32B5/24; B32B5/26; B32B7/022; B32B7/027; B32B15/08; B32B27/04; B32B27/12; B64C1/00; B64D11/00; H05B3/10
Attorney, Agent or Firm:
Hiromichi Kobayashi
Tomioka Kiyoshi
Tomioka Kiyoshi