Title:
SEMICONDUCTOR MANUFACTURING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2020013841
Kind Code:
A
Abstract:
To solve such a problem that, when abnormalities on a surface of a die are detected by imaging using a camera, it is difficult to determine from a captured image whether the abnormalities are due to cracks or foreign matters.SOLUTION: A semiconductor manufacturing device includes: an imaging device imaging a die; a lighting system having a first state where the die is irradiated with light at an angle of less than 45 degrees to an optical axis of the imaging device, and a second state where the die is irradiated with light at an angle of more than 45 degrees; and a control unit for controlling the imaging device and the lighting system. The control unit recognizes abnormalities on a surface of the die on the basis of a first image of the die imaged by the imaging device while the lighting system is brought into the first state, and a second image of the die imaged by the imaging device while the lighting system is brought into the second state.SELECTED DRAWING: Figure 2
Inventors:
KOBASHI HIDEHARU
HOSAKA KOJI
MATSUZAKI YUKI
HOSAKA KOJI
MATSUZAKI YUKI
Application Number:
JP2018133873A
Publication Date:
January 23, 2020
Filing Date:
July 17, 2018
Export Citation:
Assignee:
FASFORD TECH CO LTD
International Classes:
H01L21/52
Domestic Patent References:
| JP2017117916A | 2017-06-29 | |||
| JP2010223964A | 2010-10-07 | |||
| JPS57132044A | 1982-08-16 | |||
| JP2008270278A | 2008-11-06 | |||
| JPS6157837A | 1986-03-24 |
Foreign References:
| KR20090126066A | 2009-12-08 | |||
| US20020093812A1 | 2002-07-18 |
Attorney, Agent or Firm:
Polaire Patent Business Corporation