Title:
METHOD AND DEVICE FOR CUTTING MULTILAYER SUBSTRATE
Document Type and Number:
Japanese Patent JP2020017471
Kind Code:
A
Abstract:
To suppress a scribe wheel from deviating from a desired line where a cutting line is to be formed, in cutting a multilayer substrate, such as OLEDs, using a scribe wheel.SOLUTION: A method for cutting a flexible OLED (multilayer substrate) comprising a first LET layer L2, a PI layer L1, and a second PET layer L3 includes a first laser cutting step and a wheel cutting step. In the first laser cutting step, a first groove G1 having an opening angle θ ranging from 45 degrees to 100 degrees is formed in the first PET layer L2. In the wheel cutting step, a cutting line SL is formed in the PI layer L1 while a scribe wheel SW is passed through the first groove G1.SELECTED DRAWING: Figure 3
Inventors:
UENO TSUTOMU
NISHIO JINKO
TAKAMATSU IKUYOSHI
SAKAI TOSHIYUKI
NISHIO JINKO
TAKAMATSU IKUYOSHI
SAKAI TOSHIYUKI
Application Number:
JP2018141221A
Publication Date:
January 30, 2020
Filing Date:
July 27, 2018
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD
International Classes:
H05B33/10; B23K26/364; B26D1/14; B26D3/00; B26D7/08; H01L51/50; H05B33/02
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation