Title:
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD, RESIN FILM AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2020036011
Kind Code:
A
Abstract:
To provide a resin film which can prevent cracking or fracture of an insulation layer in the periphery of a via hole and a wiring circuit layer of a via part, and can enhance connection reliability.SOLUTION: A resin film contains a thermosetting compound and an inorganic filler, and has exothermic peak top temperature of 130°C or higher and 200°C or lower in measurement with a differential scanning calorimeter, in which among exothermic peaks having an exothermic peak top temperature of 130°C or higher and 200°C or lower, when a peak temperature of the exothermic peak having the maximum peak height is represented by T°C, an average thermal expansion coefficient of a cured product of a resin film at 25°C or higher and 150°C or lower when being cured at (T+50)°C for 1.5 hours is represented by CTE, and an average thermal expansion coefficient of a cured product of a resin film at 25°C or higher and 150°C or lower when being cured at (T+50)°C for 7.5 hours is represented by CTE, a ratio of CTEto CTEis 0.75 or more and 1.4 or less.SELECTED DRAWING: Figure 1
Inventors:
KAWAHARA YUKO
HAYASHI TATSUJI
TANAKA TERUHISA
KOYANAGI HIROSHI
HAYASHI TATSUJI
TANAKA TERUHISA
KOYANAGI HIROSHI
Application Number:
JP2019154861A
Publication Date:
March 05, 2020
Filing Date:
August 27, 2019
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H05K3/46
Domestic Patent References:
| JP2010053334A | 2010-03-11 | |||
| JP2013075948A | 2013-04-25 | |||
| JP2005285540A | 2005-10-13 | |||
| JP2011219674A | 2011-11-04 | |||
| JP2012102227A | 2012-05-31 | |||
| JP2013104029A | 2013-05-30 | |||
| JP2018065904A | 2018-04-26 |
Foreign References:
| WO2018105691A1 | 2018-06-14 |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office