Title:
MOLDED SHEET, METHOD FOR MANUFACTURING MOLDED SHEET, SHEET AND METHOD FOR MANUFACTURING SHEET
Document Type and Number:
Japanese Patent JP2020044737
Kind Code:
A
Abstract:
To provide a molded sheet in which peeling of a thermal-expansion layer from a base material is suppressed, a method for manufacturing a molded sheet, a sheet and a method for manufacturing a sheet.SOLUTION: The molded sheet includes a base material having a first main surface 22 and a second main surface opposite to the first main surface, N (where N is an integer of 2 or more) of thermal expansion layers 32, 34 containing thermal expansion fine particles 33b, 35b and stacked on the first main surface 22. The average particle diameter of the thermal expansion fine particles 35b included in the M-th (where M is an integer of 2 or more and N or less) thermal expansion layer 34 is greater than the average particle diameter of the thermal expansion fine particles 33b included in the M-1-th thermal expansion layer 32.SELECTED DRAWING: Figure 3
Inventors:
TAKAHASHI HIDEKI
Application Number:
JP2018175282A
Publication Date:
March 26, 2020
Filing Date:
September 19, 2018
Export Citation:
Assignee:
CASIO COMPUTER CO LTD
International Classes:
B32B27/18; B32B3/14; B41M3/06
Domestic Patent References:
| JPS63120180A | 1988-05-24 |
Attorney, Agent or Firm:
Kimura Mitsuru