RESIN COMPOSITION, CURED PRODUCT, SINGLE LAYER RESIN SHEET, LAMINATE RESIN SHEET, PREPREG, METAL FOIL-CLAD LAMINATE, PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL AND ADHESIVE

Title:

Document Type and Number:

Japanese Patent JP2020045429

Kind Code:

A

Abstract:

To provide a resin composition which expresses excellent thermal conductivity, a cured product, a single layer resin sheet, a laminate resin sheet, a prepreg, a metal foil-clad laminate, a printed wiring board, a sealing material, a fiber-reinforced composite material and an adhesive.SOLUTION: A resin composition contains a cyanate compound (A) represented by the formula (1), and an epoxy compound (B) represented by the formula (5).SELECTED DRAWING: None

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Inventors:

KATAGIRI SHUNSUKE
NAKANISHI KOHEI

Application Number:

JP2018175047A

Publication Date:

March 26, 2020

Filing Date:

September 19, 2018

Export Citation:

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Assignee:

MITSUBISHI GAS CHEMICAL CO

International Classes:

C08G59/40; B32B15/092; B32B27/38; C08J5/24; C08K3/013; C08K5/315; C08L63/06; C09J163/06; C09K3/10; H05K1/03

Attorney, Agent or Firm:

Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito

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