Title:
RESIN COMPOSITION, RESIN SHEET, CURED FILM, PRODUCTION METHOD OF CURED FILM, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP2020066651
Kind Code:
A
Abstract:
To provide a photosensitive resin composition capable of obtaining a cured film having high chemical resistance by suppressing wrinkle during curing, and capable of suppressing occurrence of crack of the cured film after the reliability test of a device to which the cured film is applied.SOLUTION: A resin composition containing (A) a resin selected from preferably a polyimide, polyamic acid, and polybenzoxazole, and (B) a resin composition containing a thermal crosslinking agent, in which (B) the thermal crosslinking agent contains at least a resol resin.SELECTED DRAWING: None
Inventors:
HASHIMOTO KEIKA
MASUDA YUKI
TOMIKAWA MASAO
MASUDA YUKI
TOMIKAWA MASAO
Application Number:
JP2018198540A
Publication Date:
April 30, 2020
Filing Date:
October 22, 2018
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L61/06; C08L79/08; C08L101/00; G03F7/004; G03F7/023; G03F7/027; G03F7/037; G03F7/11; H01L23/12; H01L23/14
Domestic Patent References:
| JP2008088251A | 2008-04-17 |
Foreign References:
| WO2010087238A1 | 2010-08-05 | |||
| WO2011030744A1 | 2011-03-17 | |||
| WO2017217292A1 | 2017-12-21 |