Title:
OPTICAL MODULE
Document Type and Number:
Japanese Patent JP2020080347
Kind Code:
A
Abstract:
To improve heat dissipation efficiency.SOLUTION: An optical module includes: a substrate in which a conductor is arranged in an inner layer, and a part of the conductor is exposed at an end face; and an optical element bonded to the part of the conductor exposed at the end face of the substrate.SELECTED DRAWING: Figure 2
Inventors:
YAMADA TETSUO
MASUDA YASUSHI
ISHIKAWA NAOKI
TAKEUCHI SHUICHI
MASUDA YASUSHI
ISHIKAWA NAOKI
TAKEUCHI SHUICHI
Application Number:
JP2018212122A
Publication Date:
May 28, 2020
Filing Date:
November 12, 2018
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01S5/024; H01S5/022
Attorney, Agent or Firm:
Sakai International Patent Office