Title:
BASE FILM FOR SEMICONDUCTOR MANUFACTURING PROCESS AND ADHESIVE FILM FOR DICING USING BASE FILM
Document Type and Number:
Japanese Patent JP2020084143
Kind Code:
A
Abstract:
To provide a film which is excellent in film-forming property, has excellent antistatic performance and is also excellent in mechanical properties such as flexibility and heat-resistant stability.SOLUTION: There is provided a base film for a semiconductor manufacturing process which has at least one resin layer composed of a resin composition comprising 25 to 40 mass% of a homopolypropylene, 21 to 39 mass% of a polymer-type antistatic agent and 21 to 54 mass% of a thermoplastic elastomer (the total amount of the homopolypropylene, the polymer-type antistatic agent and the thermoplastic elastomer in the resin composition is defined as 100 mass%).
Inventors:
NAGASAWA TOMOYA
KAWAGUCHI YUJI
KAWAGUCHI YUJI
Application Number:
JP2018225268A
Publication Date:
June 04, 2020
Filing Date:
November 30, 2018
Export Citation:
Assignee:
DIAPLUS FILM INC
International Classes:
C08J5/18; C08L23/12; C08L53/00; C08L71/02; C09J7/29; H01L21/301
Domestic Patent References:
| JP2012069999A | 2012-04-05 | |||
| JP2008153431A | 2008-07-03 | |||
| JP2008147341A | 2008-06-26 | |||
| JP2016210898A | 2016-12-15 |
Attorney, Agent or Firm:
Makoto Ono
Kenkyo Kanayama
Mitsuaki Tsubokura
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Takahiro Aoki
Yoshie Sakurada
Yousuke Kawasaki
Takuya Gomibuchi
Toshikazu Imato
Yoichi Iino
Yusuke Ichikawa
Masahiro Moriyama
Yoshikazu Iwase
Yasufumi Shiroyama
Kenkyo Kanayama
Mitsuaki Tsubokura
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Takahiro Aoki
Yoshie Sakurada
Yousuke Kawasaki
Takuya Gomibuchi
Toshikazu Imato
Yoichi Iino
Yusuke Ichikawa
Masahiro Moriyama
Yoshikazu Iwase
Yasufumi Shiroyama