Title:
RESIN MOLDING ANALYSIS METHOD, PROGRAM, AND RECORDING MEDIUM
Document Type and Number:
Japanese Patent JP2020087446
Kind Code:
A
Abstract:
To provide a resin molding analysis method which allows for minimizing an increase in processing time for analyzing resin formation.SOLUTION: A resin molding analysis method provided herein comprises: associating resin molding condition information with output values based on measured values obtained by measuring properties of corresponding resin molded products as resin molding information and accumulating the same; and estimating properties of a resin molded product from an entered resin molding condition using a plurality of accumulated pieces of resin molding information, and outputting an estimated result as property information.SELECTED DRAWING: Figure 3
Inventors:
YAMADA TAKAMITSU
HIROI MASATO
HIROI MASATO
Application Number:
JP2019199733A
Publication Date:
June 04, 2020
Filing Date:
November 01, 2019
Export Citation:
Assignee:
TORAY ENG CO LTD
International Classes:
G06F30/23; B29C45/76; G01N3/04; G06F30/10; G06F30/27
Domestic Patent References:
| JP2009271781A | 2009-11-19 | |||
| JP2001277320A | 2001-10-09 | |||
| JP2017162294A | 2017-09-14 |
Attorney, Agent or Firm:
Hirokazu Miyazono