Title:
POLYPROPYLENE RESIN COMPOSITION, PACKAGING MATERIAL AND PACKAGE
Document Type and Number:
Japanese Patent JP2020090559
Kind Code:
A
Abstract:
To provide a polypropylene resin composition having a draw resonance resistance capable of, in thermoforming such as extrusion molding of a polypropylene resin, inhibiting a periodical thickness variation due to a draw resonance that occurs at the thermoforming, hardly causing an unstable flow or meander phenomenon at laminating, and capable of obtaining a uniform film thickness, and also to provide a packaging material and a package formed using the polypropylene resin composition.SOLUTION: A polypropylene resin composition includes a mixed resin composition mixing 85-90 wt.% of one propylene-based polymer from among a propylene homopolymer, a propylene-based block copolymer or a propylene-ethylene random copolymer and 10-15 wt.% of a low-density polyethylene. The propylene-based polymer has a melt flow rate (MFR) (temperature 230°C, a load 2.16 kg) within a range from 2.0 g/10 min. to 10.0 g/10 min.SELECTED DRAWING: Figure 1
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Inventors:
HAMADA DAISUKE
Application Number:
JP2018226436A
Publication Date:
June 11, 2020
Filing Date:
December 03, 2018
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
C08L23/10; C08L23/06
Domestic Patent References:
| JP2004195955A | 2004-07-15 | |||
| JP2018053180A | 2018-04-05 | |||
| JP2006188562A | 2006-07-20 |