Title:
CHEMICALLY AMPLIFIED PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD FOR MANUFACTURING PATTERNED RESIST FILM, METHOD FOR MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD FOR MANUFACTURING PLATED MOLDED ARTICLE, AND COMPOUND
Document Type and Number:
Japanese Patent JP2020106696
Kind Code:
A
Abstract:
To provide a chemically amplified photosensitive composition that facilitates formation of a resist pattern having a rectangular cross-sectional shape and has a wide margin of a depth of focus (DOF), a photosensitive dry film that includes a photosensitive layer made of the chemically amplified photosensitive composition, a method for manufacturing a patterned resist film using the above chemically amplified photosensitive composition, a method for manufacturing a substrate with a template using the above chemically amplified photosensitive composition, a method for manufacturing a plated molded article using the above substrate with a template, and a novel compound.SOLUTION: The chemically amplified photosensitive composition is obtained by compounding an acid diffusion inhibitor (C) having a specific structure in a chemically amplified photosensitive composition containing an acid generator (A) that generates an acid by irradiation with active rays or radiation.SELECTED DRAWING: None
Inventors:
KAWAKAMI AKINARI
KUROIWA YASUSHI
KUROIWA YASUSHI
Application Number:
JP2018246206A
Publication Date:
July 09, 2020
Filing Date:
December 27, 2018
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/004; C07C229/60; G03F7/039; G03F7/20
Domestic Patent References:
| JP2011059277A | 2011-03-24 | |||
| JP2015034926A | 2015-02-19 | |||
| JP2018169543A | 2018-11-01 | |||
| JP2015194715A | 2015-11-05 | |||
| JP2013178505A | 2013-09-09 | |||
| JP2016053060A | 2016-04-14 | |||
| JP2012525386A | 2012-10-22 | |||
| JP2012525442A | 2012-10-22 |
Foreign References:
| US3756983A | 1973-09-04 |
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi
Hayashi Ichiyoshi